Luowei CPU-Qualcomm Stencil Set
67.00 LYD
Precision BGA reballing stencil set designed for Qualcomm CPU packages, tailored to apply solder balls accurately during rework and reballing operations.
In stock
The Luowei CPU‑Qualcomm Stencil Set is a precision‑manufactured stainless steel mesh stencil used in BGA reballing and CPU rework for Qualcomm Snapdragon series processors. Designed with square aperture patterns and high‑temperature resistant steel, this stencil enables consistent and accurate solder ball placement on CPU pads during reball and rework procedures. Suitable for professional mobile repair technicians, the Luowei set improves uniform solder deposition and reduces bridging and misalignment risks during CPU rework on motherboards. Typical compatibility includes a range of Qualcomm Snapdragon CPU IC types used in smartphones and tablets.
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