Description
– Stencil compatible with Qualcomm power ICs such as PM8937, PMI8940, PMI8994, and PM8952.
– Made of stainless steel for even solder paste distribution.
16.00 LYD
BGA reballing stencil tool for IC chips.
In stock
– Stencil compatible with Qualcomm power ICs such as PM8937, PMI8940, PMI8994, and PM8952.
– Made of stainless steel for even solder paste distribution.