Description
The AMAOE MP1 stencil is designed for reballing BGA ICs on mobile phone circuit boards. Made of corrosion-resistant steel and supports various IC models from brands like MTK and Qualcomm.
16.00 LYD
Tool for reballing ICs
In stock
The AMAOE MP1 stencil is designed for reballing BGA ICs on mobile phone circuit boards. Made of corrosion-resistant steel and supports various IC models from brands like MTK and Qualcomm.