High-Temperature BGA Reballing Glass Gasket / Stencil Press
15.00 LYD
An ultra-clear, high-temperature resistant, explosion-proof glass gasket. The ultimate magic tool specifically designed to be placed directly over BGA stencils during the reballing process. It absolutely prevents the stencil from bulging or warping under intense hot air, completely eliminating solder ball bursting and bridging. Ensures first-time success when reballing large CPUs, all while maintaining a crystal-clear view of the solder reflow.
In stock
This glass is the true secret behind flawless, error-free reballing operations in advanced repair shops. The ~4cm size is meticulously chosen to cover large CPUs, which often fail during reballing due to thermal expansion and stencil warping under high heat.
Technical Specifications & Features:
Anti-Stencil Bulging: Acts as a perfectly flat, stable weight over the steel stencil, forcing it to remain entirely flush against the IC during hot air application. This strictly prevents liquid solder from bleeding between pads.
Prevents Solder Bursting: Actively suppresses the splattering and bursting of solder balls caused by pad oxidation or boiling flux, elevating your BGA reballing success rate to unprecedented levels.
Ultra-Clear Visibility: Full optical transparency that does not obstruct your view. Allows the technician to clearly watch the solder paste transform into shiny spheres under the microscope, indicating exactly when to remove the heat.
Massive Thermal Endurance: Industrially treated glass engineered to withstand the maximum temperatures of hot air rework stations without cracking, deforming, or losing its perfect flatness, ensuring an incredibly long service life.
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