Description
BGA stencil designed for reballing power ICs from Qualcomm series like PM6150 and PM660A. Ensures precision in applying solder paste before heating with hot air.
16.00 LYD
Stencil for BGA reballing
In stock
BGA stencil designed for reballing power ICs from Qualcomm series like PM6150 and PM660A. Ensures precision in applying solder paste before heating with hot air.