AMAOE SAM 14 Stencil
19.00 LYD
Tool for BGA reballing for phones
In stock
– Stencil designed for BGA reballing on Samsung phones.
– Made of stainless steel with a thickness of 0.12 mm.
– Laser-cut holes for precise solder paste distribution.
– Supports chips like Exynos 7870, 7884, 7885, 7904, 9610, and 9611.
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