XZZ AR SAM Middle Layer Reballing Stencil Kit for Samsung S21 S22 S23 S24 s25 Ultra
585.00 LYD
XZZ / AR SAM Middle Layer BGA Reballing Stencil Kit for Samsung S21–S25 Ultra — precise alignment and metal ball planting platform.
| Model |
S21 Ultra ,S22 Ultra ,S23 Ultra ,S24 Ultra ,S25 Ultra |
|---|
In stock
The XZZ / AR SAM Middle Layer Reballing Stencil Kit is a professional-grade platform designed for BGA reballing on Samsung Galaxy S21 through S25 Ultra boards.
It allows precise positioning of solder balls on the middle layer of BGA components using a dedicated stencil and support molds, ensuring accuracy and stability during reballing.
Ideal for repair technicians needing precise CPU/NAND rework tools.
Only logged in customers who have purchased this product may write a review.
MAECENAS IACULIS
Vestibulum curae torquent diam diam commodo parturient penatibus nunc dui adipiscing convallis bulum parturient suspendisse parturient a.Parturient in parturient scelerisque nibh lectus quam a natoque adipiscing a vestibulum hendrerit et pharetra fames nunc natoque dui.
ADIPISCING CONVALLIS BULUM
- Vestibulum penatibus nunc dui adipiscing convallis bulum parturient suspendisse.
- Abitur parturient praesent lectus quam a natoque adipiscing a vestibulum hendre.
- Diam parturient dictumst parturient scelerisque nibh lectus.
Scelerisque adipiscing bibendum sem vestibulum et in a a a purus lectus faucibus lobortis tincidunt purus lectus nisl class eros.Condimentum a et ullamcorper dictumst mus et tristique elementum nam inceptos hac parturient scelerisque vestibulum amet elit ut volutpat.
Reviews
There are no reviews yet.