Description
The Middle Layer Reballing Stencil Kit is a professional tool designed for BGA middle layer reballing on Samsung Galaxy S21 through Galaxy S26 Ultra motherboards.
Manufactured with high precision, each stencil ensures accurate solder ball alignment for reliable reballing and efficient motherboard repair.
Features:
- Supports Samsung Galaxy S21 to S26 Ultra series.
- Designed for Middle Layer BGA reballing.
- High-precision stencil openings.
- Heat-resistant and durable construction.
- Compatible with solder balls and solder paste.
- Ideal for professional microsoldering and motherboard repair.
