MIJING High Purity Solder Tin Paste 138℃ 158℃ 183℃ 199℃
35.00 LYD
Lead-free and silver-free, high medium and low temperature solder paste, with various melting points, suitable for various electronic motherboard BGA chip soldering and repair.
| Model | 138° ,158° ,183° ,199° |
|---|
1. MIJING 138℃ 158℃ 183℃ 199℃ High Purity Tin Paste, 50G box.
2. Square mouth design, easy to use, easy to recycle excess solder paste, reducing waste.
3. Lead-free and silver-free, high medium and low temperature solder paste, with various melting points.
4. More stable welding, reducing the problem of false soldering.
5. Suitable for mobile phone motherboard/electronic circuit board/BGA chip welding repair.
6. Suitable for various electronic motherboard BGA chip soldering and repair.
7. It is a necessary solder paste for daily mobile phone repair.
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