MIJING High Purity Solder Tin Paste 138℃ 158℃ 183℃ 199℃
35.00 LYD
Liquid solder tin used for electronic board soldering
| Model | 138° ,158° ,183° ,199° |
|---|
MIJING High Purity Liquid Solder Tin is used for soldering and repairing electronic boards and BGA chips. It operates at variable melting points from 138℃ to 199℃. The material is lead and silver-free and features a square nozzle design for easy application and excess recovery. [-Weight: 50g]
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