Description

GSM-SOURCES GS-09 Solder Pad Repair Sheet is designed for phone motherboard repair and for rebuilding damaged or missing solder pads.

It is intended for situations where a solder pad has been damaged or lifted during repair work. The appropriate repair piece can be selected, positioned on the damaged area, and soldered into place according to the requirements of the repair.

The sheet contains multiple solder pad repair shapes, helping technicians perform board repair and micro soldering work with greater flexibility, especially when rebuilding damaged or missing pads.

Solder pad repair pieces can provide a practical alternative for certain repairs that would otherwise require manually forming a small jumper wire connection. The appropriate shape should be selected according to the repair area and the board layout.

Applications:

• Repairing damaged or missing solder pads.
• Rebuilding solder pads on phone motherboards.
• Motherboard repair after lifted or damaged pads.
• Micro soldering and board repair work.
• Repairing connection points around IC and CPU areas when applicable to the board repair.
• Using pre-formed repair pieces when rebuilding a pad instead of manually forming a repair point.