Description

This product revolutionizes micro-soldering by completely eliminating the frustrating, time-consuming process of manually curling micro-jumper wires to rebuild torn pads. The RL-007GA provides a rapid, radical solution that restores the logic board to its factory state with profound professionalism, tremendously increasing repair efficiency.

Technical Specifications & Features:

• Massive Variety (1400 Pcs): Offers 10 distinct shapes and sizes to perfectly match any missing solder pad footprint on iPhone and Android logic boards with pinpoint accuracy.

• Ultra-Thin Profile (30um): Crafted from industrial-grade copper foil to guarantee absolute flatness after installation. This strictly prevents pseudo-soldering issues caused by the unevenness of traditional coiled jumper wires.

• Strong Mechanical Bond: Engineered with built-in “fixed pins” that anchor the lug deeply into the exposed circuit trace, ensuring it is firmly reinforced and will never detach.

• Seamless UV Mask Integration: The pure copper surface bonds exceptionally well and is easily secured with UV curing solder mask ink (green oil) for permanent, insulated stability.

• Sandwich Board Reliability: Delivers a highly saturated, electrically stable BGA bonding surface. Repaired double-layered motherboards can be immediately installed into test fixtures or recombined with total confidence in the welding strength.