Description

MIJING AR-2020 is a desoldering wick designed for mobile phone motherboard repair, electronics repair, and micro soldering applications. It is used to absorb and remove molten solder from solder pads and components during repair work.

The AR-2020 has a 2.0mm width and a 2-meter length per wick, making it suitable for cleaning solder pads and removing excess solder from repair areas on phone motherboards.

The wick uses high-purity copper braiding to absorb molten solder. It also features an oxidation-resistant coating and a low-residue design to help keep the work area clean after solder removal. Published product specifications state an absorption capability of up to 80%.

Its flexible construction allows it to be used in small and precise areas on the motherboard, including IC cleaning and solder removal before further repair work.

It is suitable for mobile phone repair technicians and professional Board Repair and Micro Soldering applications.