2UUL BG01 ABCD BGA Stencil Set for iPhone
69.00 LYD
Stencil set for reballing iPhone chipsets.
In stock
The 2UUL BG01 ABCD set consists of 4 stencils designed for working on iPhone chipsets from version 8 to 16 Pro Max. These stencils are made of heat-resistant steel and offer high precision alignment to ensure efficient solder ball reattachment.
– Pieces: 4
– Compatibility: iPhone 8 to 16 Pro Max
– Thickness: 0.12 mm
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