SKU: 3419

YCS ORAGON ARC PAD BGA IC Soldering Heat-Resistant Mat

Original price was: 47.00 LYD.Current price is: 33.00 LYD.

YCS Universal Insulation Tin-Plating Curved Pad for Mobile Phone Motherboard CPU IC BGA Soldering Heat Dissipation Mat Cushion

YCS ORAGON ARC pad (0.3mm 0.45mm 0.77mm).

 

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SKU: 3419 Categories: , ,
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