SKU: 3419

YCS ORAGON ARC PAD BGA IC Soldering Heat-Resistant Mat

47.00 LYD

YCS Universal Insulation Tin-Plating Curved Pad for Mobile Phone Motherboard CPU IC BGA Soldering Heat Dissipation Mat Cushion

YCS ORAGON ARC pad (0.3mm 0.45mm 0.77mm).

 

In stock

  • Check Mark Free shipping for all orders starting from 500 LYD
  • Check Mark Tripoli : delivery in the same day if order is placed before 12PM
  • Check Mark Other Regions : delivery in 2 or 3 days
Add to wishlist

Reviews

There are no reviews yet.

Only logged in customers who have purchased this product may write a review.

Related products