SKU: 3419

YCS ORAGON ARC PAD BGA IC Soldering Heat-Resistant Mat

47.00 LYD

YCS Universal Insulation Tin-Plating Curved Pad for Mobile Phone Motherboard CPU IC BGA Soldering Heat Dissipation Mat Cushion

YCS ORAGON ARC pad (0.3mm 0.45mm 0.77mm).

 

Out of stock

Notify me when the item is back in stock.

  • Check Mark Free shipping for all orders starting from 500 LYD
  • Check Mark Tripoli : delivery in the same day if order is placed before 12PM
  • Check Mark Other Regions : delivery in 2 or 3 days
Add to wishlist

Reviews

There are no reviews yet.

Only logged in customers who have purchased this product may write a review.

Related products