Mijing 3D Stencil For iPhone XR XS
Original price was: 60.00 LYD.20.00 LYDCurrent price is: 20.00 LYD.
High-precision Mijing 3D stencil designed for reballing iPhone XR/XS CPU. Ensures accurate heat distribution and stable, professional-grade reballing.
Out of stock
The Mijing 3D Reballing Stencil is engineered for professional technicians who work on iPhone motherboard repairs. Specifically designed for iPhone XR and iPhone XS CPU reballing, this 3D stencil offers exceptional accuracy and stability. Its advanced structure ensures even heat distribution during the reballing process, reducing errors and improving overall repair quality. Crafted from durable, heat-resistant metal, it provides long-lasting performance and reliable results for precision repair work.
Only logged in customers who have purchased this product may write a review.
MAECENAS IACULIS
Vestibulum curae torquent diam diam commodo parturient penatibus nunc dui adipiscing convallis bulum parturient suspendisse parturient a.Parturient in parturient scelerisque nibh lectus quam a natoque adipiscing a vestibulum hendrerit et pharetra fames nunc natoque dui.
ADIPISCING CONVALLIS BULUM
- Vestibulum penatibus nunc dui adipiscing convallis bulum parturient suspendisse.
- Abitur parturient praesent lectus quam a natoque adipiscing a vestibulum hendre.
- Diam parturient dictumst parturient scelerisque nibh lectus.
Scelerisque adipiscing bibendum sem vestibulum et in a a a purus lectus faucibus lobortis tincidunt purus lectus nisl class eros.Condimentum a et ullamcorper dictumst mus et tristique elementum nam inceptos hac parturient scelerisque vestibulum amet elit ut volutpat.
Reviews
There are no reviews yet.