2UUL FD15 Find210-O BallPoint Golden Soldering Iron Tip (1 Pack)
37.00 LYD
Specialized Ball-Point (Round) C210 soldering tip with Gold plating. Designed specifically for rolling and distributing solder to create uniform tin bumps on iPhone Sandwich Board (Middle Layer) frames and FPC connector pads.
In stock
Product Overview: The 2UUL FD15 Find210-O is not just a cleaning tip; it is a precision tool for “Pad Re-tinning”. Its unique spherical (Ball) shape allows technicians to “roll” molten solder across the motherboard pads. This technique is essential for preparing the Middle Layer of iPhone boards (X to 15 Series) and FPC connectors, ensuring that every pad has a perfect, uniform dome of solder for a secure connection.
Key Features:
Rolling Solder Distribution: The round tip acts like a roller, spreading tin evenly across multiple pads in one go without bridging or scraping the solder mask.
Middle Layer Preparation: Perfect for “tinning” the frame of double-layered motherboards (Sandwich boards) to create fresh, raised solder points before re-soldering the layers together.
FPC Connector Repair: Ideal for refreshing the pads of FPC connectors, giving them the necessary solder height for a good connection.
Golden Plating: The specialized gold coating prevents the solder from sticking too much to the tip itself, allowing it to flow smoothly onto the board pads.
Non-Damaging: Unlike knife tips, the smooth ball shape eliminates the risk of scratching traces or digging into the board layers.
Specifications:
Brand: 2UUL
Model: FD15 (Find210-O)
Tip Shape: Ball-Point (Round)
Application: Middle Layer Tinning, FPC Pad Reballing
Compatibility: C210 / T210 Handles
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