Description

This product is the absolute secret behind first-time successful BGA reballing. The Chip Quik REP183AX50T4 paste guarantees shiny, perfectly spherical joints that wet instantly without boiling off or leaving disruptive carbon residues on the logic board.

Technical Specifications & Features:

• Optimal Alloy (Sn63/Pb37): The classic tin/lead mixture delivers the standard 183°C melting point, the safest and most widely adopted temperature for smartphone IC repair to prevent thermal damage.

• Ultra-Fine Particles (T4 Mesh): Particle sizes ranging from 20 to 38 µm ensure the paste effortlessly glides through the tightest BGA stencil apertures without clogging or clumping.

• Synthetic No-Clean Flux (ROL0): Integrated with top-tier flux that actively prevents oxidation during reflow, leaving only transparent, non-conductive residues that require zero post-solder washing.

• High Metal Load (90% Content): The dense 90% metal weight ratio drastically prevents solder ball shrinkage after cooling, resulting in mechanically robust and electrically stable solder joints that resist drop impacts.