Original Chip Quik REP183AX50T4 Solder Paste (183°C) – 50g
80.00 LYD
High-performance solder paste by the renowned American brand Chip Quik (Model REP183AX50T4). Features the industry-standard Sn63/Pb37 alloy with a perfect 183°C melting point. Utilizes fine T4 mesh particles for flawless distribution under ICs and highly precise BGA reballing. Its synthetic No-Clean formula makes it the premier choice for advanced micro-soldering and PCB rework.
In stock
This product is the absolute secret behind first-time successful BGA reballing. The Chip Quik REP183AX50T4 paste guarantees shiny, perfectly spherical joints that wet instantly without boiling off or leaving disruptive carbon residues on the logic board.
Technical Specifications & Features:
Optimal Alloy (Sn63/Pb37): The classic tin/lead mixture delivers the standard 183°C melting point, the safest and most widely adopted temperature for smartphone IC repair to prevent thermal damage.
Ultra-Fine Particles (T4 Mesh): Particle sizes ranging from 20 to 38 µm ensure the paste effortlessly glides through the tightest BGA stencil apertures without clogging or clumping.
Synthetic No-Clean Flux (ROL0): Integrated with top-tier flux that actively prevents oxidation during reflow, leaving only transparent, non-conductive residues that require zero post-solder washing.
High Metal Load (90% Content): The dense 90% metal weight ratio drastically prevents solder ball shrinkage after cooling, resulting in mechanically robust and electrically stable solder joints that resist drop impacts.
Only logged in customers who have purchased this product may write a review.
MAECENAS IACULIS
Vestibulum curae torquent diam diam commodo parturient penatibus nunc dui adipiscing convallis bulum parturient suspendisse parturient a.Parturient in parturient scelerisque nibh lectus quam a natoque adipiscing a vestibulum hendrerit et pharetra fames nunc natoque dui.
ADIPISCING CONVALLIS BULUM
- Vestibulum penatibus nunc dui adipiscing convallis bulum parturient suspendisse.
- Abitur parturient praesent lectus quam a natoque adipiscing a vestibulum hendre.
- Diam parturient dictumst parturient scelerisque nibh lectus.
Scelerisque adipiscing bibendum sem vestibulum et in a a a purus lectus faucibus lobortis tincidunt purus lectus nisl class eros.Condimentum a et ullamcorper dictumst mus et tristique elementum nam inceptos hac parturient scelerisque vestibulum amet elit ut volutpat.
Reviews
There are no reviews yet.