Mijing Kit For Cpu & IC
107.00 LYD
A professional reballing and IC handling kit designed for CPU and IC repair on smartphone motherboards, supporting precise solder ball placement and chip rework.
In stock
The MIJING CPU & IC Reballing Tool Kit is a workshop-grade solution for mobile repair technicians performing CPU and IC reballing operations. The kit is designed to assist in removing, cleaning, reballing, and reinstalling ICs on smartphone PCBs.
It typically includes precision reballing accessories such as IC holders, reballing tools, and auxiliary tools compatible with BGA packages commonly found in mobile CPUs and baseband ICs.
Manufactured with heat-resistant and durable materials, the kit supports use with hot air stations and preheaters, ensuring stable IC positioning during solder ball application. Suitable for Android and iPhone motherboard-level repairs, especially CPU, power IC, and baseband IC rework.
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