B&R HT-553 Flux Paste
27.00 LYD
High‑viscosity flux paste formulated for PCB rework, BGA reballing, and fine‑pitch SMD soldering applications, supplied in a controlled squeeze tube.
In stock
The B&R HT‑553 Flux Paste is a professional‑grade soldering flux in paste form, delivered in a syringe‑style tube for precise application. It is designed to improve wetting, remove oxidation at solder joints, and facilitate reliable solder flow on PCB pads and component leads during rework and repair tasks, including BGA reballing and SMD rework. The paste consistency ensures minimal spread beyond the target area, reducing the risk of contamination on nearby components. Suitable for use with hot air stations and irons during mobile phone motherboard repair and electronics assembly. Typical packaging volume is ~10 cc.*
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