Amaoe A11 Stencil IPhone 8 8P X
19.00 LYD
Precision BGA reballing stencil designed for iPhone 8 and iPhone X IC reballing and solder ball alignment
In stock
Amaoe Stencil IPhone 8-8P-X-A11
This iPhone 8 / iPhone X reballing stencil is engineered for accurate BGA rework on Apple logic boards. Manufactured from heat-resistant stainless steel, it provides precise hole alignment for consistent solder ball placement on ICs. The stencil thickness is optimized to ensure uniform solder distribution and stable results during reballing operations.
Suitable for professional mobile repair technicians performing CPU, Baseband, Power IC, and other IC reballing on iPhone 8 and iPhone X motherboards. Compatible with hot air soldering stations and infrared rework systems.
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