Description
– AMAOE Stencil NAND1 with 0.15mm thickness
– Used for reballing BGA boards such as BGA107, BGA95, BGA182
16.00 LYD
Stencil for mobile phone maintenance
In stock
– AMAOE Stencil NAND1 with 0.15mm thickness
– Used for reballing BGA boards such as BGA107, BGA95, BGA182