SKU: 3419

YCS ORAGON ARC Pad BGA IC Soldering Heat-Resistant Mat

25.00 LYD

Mat designed to resist heat during BGA IC soldering.

Out of stock

SKU: 3419 Categories: , , Brand:

Description

The YCS ORAGON ARC mat is designed to withstand high temperatures and is ideal for use in BGA IC soldering. It provides an insulating surface to improve heat dissipation and direction efficiently.

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