ULTRA BGA SOLDER PASTE 183°C
Original price was: 29.00 LYD.25.00 LYDCurrent price is: 25.00 LYD.
ULTRA BGA SOLDER PASTE 183°C (Sn62/Pb36/Ag2) 50g Mid Temperature Tin Lead Solder Paste
In stock
The ULTRA BGA Solder Paste 183 °C is a professional‑grade soldering compound formulated for mobile phone motherboard, BGA chip reflow, and precision electronic repairs. With a eutectic alloy (typically Sn63/Pb37), this paste melts consistently at 183 °C, offering dependable flow, strong mechanical bonds, and excellent electrical conductivity. Its fine particle size and stable viscosity enable accurate application through stencils or syringe dispensing, minimizing bridging and reducing rework. Ideal for use with hot air stations, reflow ovens, and micro‑soldering setups in repair labs and service centers. Compatible with BGA reballing, CPU/GPU board work, and other SMT/PCB soldering tasks.
Only logged in customers who have purchased this product may write a review.
MAECENAS IACULIS
Vestibulum curae torquent diam diam commodo parturient penatibus nunc dui adipiscing convallis bulum parturient suspendisse parturient a.Parturient in parturient scelerisque nibh lectus quam a natoque adipiscing a vestibulum hendrerit et pharetra fames nunc natoque dui.
ADIPISCING CONVALLIS BULUM
- Vestibulum penatibus nunc dui adipiscing convallis bulum parturient suspendisse.
- Abitur parturient praesent lectus quam a natoque adipiscing a vestibulum hendre.
- Diam parturient dictumst parturient scelerisque nibh lectus.
Scelerisque adipiscing bibendum sem vestibulum et in a a a purus lectus faucibus lobortis tincidunt purus lectus nisl class eros.Condimentum a et ullamcorper dictumst mus et tristique elementum nam inceptos hac parturient scelerisque vestibulum amet elit ut volutpat.
Reviews
There are no reviews yet.