The RELIFE SP-50 Solder Paste is engineered for professional mobile phone repair technicians who require reliable soldering performance for micro-components.
Formulated with a low melting point of 158 °C, it minimizes the risk of overheating or damaging sensitive parts during rework.
SKU: 251
Small Inside Parts For iPhone 7 Plus Original price was: 15.00 LYD.15.00 LYDCurrent price is: 15.00 LYD.
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RELIFE SP-50 – Special Lead Solder Paste (158 °C, 40 g)
Original price was: 30.00 LYD.27.00 LYDCurrent price is: 27.00 LYD.
High-performance solder paste with a low melting point of 158 °C, ideal for precise BGA and IC rework on smartphone motherboards. Ensures strong bonding, smooth flow, and clean results.
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Relife
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