Mijing 3D Stencil for iPhone XR/XS Reballing
Original price was: 60.00 LYD.20.00 LYDCurrent price is: 20.00 LYD.
High-precision 3D reballing stencil designed for iPhone XR and XS CPU/PMU/IC reballing with uniform heat distribution.
Out of stock
The Mijing 3D Stencil for iPhone XR/XS is a high-accuracy reballing template engineered for BGA reballing of CPU, PMU, and baseband-related ICs. Its 3D layered construction ensures stable positioning of the IC during the reballing process, improving solder ball alignment and reducing deformation. Manufactured from heat-resistant stainless steel, the stencil maintains consistent aperture accuracy, supports uniform thermal transfer, and is compatible with hot-air and preheater platforms. This stencil is commonly used in CPU rework, PMIC repair, and baseband IC restoration on iPhone XR and XS motherboards.
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