1. For iPhone 17/Air/17 Pro/17 Pro Max motherboard middle layer tin planting. Precise positioning, fast tin planting.
2. Built-in high-temperature magnet, strong magnetic adsorption, precise positioning, no deviation, high-temperature magnetism unchanged.
3. Strong magnetic adsorption, precision hole pitch design.
4. Round and square precise holes, make the tin balls more rounded and prevent the mesh from getting stuck in the tin balls.
SKU: 023
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Mijing 3D Stencil For iPhone 6G Original price was: 55.00 LYD.5.00 LYDCurrent price is: 5.00 LYD.
AMAOE Middle-Layer Reballing Stencil Platform For iPhone 17 Series
185.00 LYD
Amaoe middle layer reballing stencil with positioning mold for iPhone Series motherboard mid-frame soldering repair.
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