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5.00 LYD
Tool designed for iPhone 6G BGA reballing
In stock
The Mijing 3D Stencil is designed for maintenance technicians for reballing board components like CPU and NAND. It features a thickness of 0.025mm and consistent thermal distribution, facilitating precise application of solder paste and reducing deformation during heating.
لتجربة تسوق أسرع وأسهل، وتنبيهات بآخر العروض والأسعار.
