Mijing 3D Stencil for iPhone 6G BGA Reballing
Original price was: 55.00 LYD.5.00 LYDCurrent price is: 5.00 LYD.
High-precision 3D reballing stencil designed for reballing iPhone 6G BGA chips with accurate ball alignment and stable heating performance.
In stock
The Mijing 3D Stencil for iPhone 6G is engineered for professional BGA reballing of NAND, CPU, and other common iPhone 6G ICs. Its 3D-formed structure ensures even heat distribution, precise solder ball positioning, and reduced warping during repeated heating cycles. Made from heat-resistant stainless steel, the stencil provides consistent results when working with SMD and BGA pads. Ideal for technicians performing chip-level repairs and rebonding operations on iPhone 6G motherboard ICs.
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