Description
iPhone 17 Pro 1SIM (EU) CNC Board for Swap – Upper + Lower
The CNC Board for Swap is a specialized replacement PCB designed for advanced iPhone motherboard repair and component transplantation.
It provides a prepared board platform for transferring original electronic components from a damaged iPhone 17 Pro motherboard to a replacement CNC-machined PCB.
The precision machining process prepares designated component areas while aiming to preserve solder pads, traces, and internal PCB layers for advanced microsoldering procedures.
Key Features
1. Precision CNC Machining
CNC machining prepares designated areas of the PCB for component transplantation and advanced board reconstruction.
2. Upper and Lower Board Layers
The product includes:
- Upper Board.
- Lower Board.
3. EU Version – 1 Physical SIM
Designed for the European iPhone 17 Pro hardware configuration with one physical SIM card. This version should not be confused with the US eSIM configuration.
4. Designed for Component SWAP
Suitable for transferring original components such as:
- CPU.
- Baseband IC.
- NAND Flash.
- EEPROM.
Applications
- Severe motherboard damage repair.
- CPU and Baseband transplantation.
- Original component transfer.
- PCB layer and trace reconstruction.
- Advanced motherboard repair and data recovery procedures.
Important Technical Note
This is a CNC-prepared replacement PCB, not a complete working motherboard. Original components must be transferred from the donor board as required by the repair procedure.
Professional microsoldering skills and specialized equipment are required.
