GSM-SOURCES SOLDER PASTER °138 °148 °183 °191 °217
25.00 LYD – 31.00 LYD
GSM Solder Paste 138 148 183 191 217 Degrees BGA Soldering Tin Flux
| model | °138 ,°148 ,°183 ,°191 ,°217 |
|---|
Mobile phone chips repair, computer and digital service industries, high-precision circuit board SMT soldering, BGA welding process, etc
Solder paste lead solder at room temperature melting point °138 °148 °183 °191 °217 forming fast and easy to weld conductive
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