SKU: 3046

GSM-SOURCES SOLDER PASTER °138 °148 °183 °191 °217

25.00 LYD31.00 LYD

GSM Solder Paste 138 148 183 191 217 Degrees BGA Soldering Tin Flux

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Description

Mobile phone chips repair, computer and digital service industries, high-precision circuit board SMT soldering, BGA welding process, etc

Solder paste lead solder at room temperature melting point °138 °148 °183 °191 °217 forming fast and easy to weld conductive

Additional information

model

°138, °148, °183, °191, °217

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