Goot Wick CP-20B Desoldering Solder Wire | (L) 30 m – (W) 2.0 mm
177.00 LYD
Goot Wick CP-20B Sucking Wire BGA Desoldering Solder Wire BGA Tin Absorbtion line
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Description
In desoldering, after the chips are taken down, the mainboard will leave a lot of soldiers, which will affect the chip welding. Usually cleaning the tin, the method is to put the iron tip on the suction tin wick and then slowly move on the chip pads, and the solder will be sucked up with the suction tin wick.
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