Amaoe A9 Stencil iPhone 6S 6SP
16.00 LYD
Amaoe Stencil iPhone 6S 6SP-A9
High‑precision stainless steel BGA reballing stencil specifically designed for CPU and NAND reball work on iPhone 6S and 6S Plus logic boards
In stock
The Amaoe A9 stencil is a professional BGA reballing template tailored for Apple iPhone 6S and iPhone 6S Plus (A9) logic board repairs. Constructed from 0.12 mm ultra‑thin stainless steel, it provides accurate alignment and consistent solder paste distribution for BGA balls during CPU and NAND chip reballing. Its precision CNC‑cut mesh holes facilitate reliable soldering results while resisting deformation under heat. This stencil simplifies reball workflows and enhances repeatability for technicians performing microsoldering and chip replacement on A9‑series boards.
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