Description

2UUL PadBall solder balls are used to reshape missing or damaged solder pads on boards. Contains solder balls with Sn63/Pb37 (63% tin / 37% lead) composition, ensuring reliable soldering. Compatible with iPhone and Android boards, and ideal for BGA tasks.
– Size options: 0.2mm, 0.3mm, 0.45mm, 0.6mm, 0.76mm
– Packaging: Anti-static bottle
– Melting point: 183°C