Solder Paste PPD 183
35.00 LYD
Professional low-melting solder paste with a 183°C melting point, designed for precise SMD and BGA soldering on mobile phone PCBs.
In stock
PPD 183 Solder Paste is a professional-grade tin-lead solder paste formulated with Sn63/Pb37 alloy, offering a stable melting point at 183°C. It provides excellent wetting, smooth flow, and strong solder joints, making it suitable for fine-pitch SMD components, BGA reballing, and IC installation on mobile phone motherboards.
The paste features controlled viscosity for easy application using syringe or stencil, minimal solder balls, and low residue after soldering. It is widely used in mobile repair workshops for rework, reballing, and precision soldering tasks requiring reliable thermal performance.
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