Description
The Amaoe 0.12mm S948U Middle Layer BGA Reballing Stencil Platform Set is a professional motherboard repair tool designed for advanced smartphone technicians working on Samsung Galaxy S26 Ultra SM-S948U logic board repairs.
This set is specifically developed for middle layer BGA reballing, providing accurate chip positioning and stable support during solder ball restoration processes.
The kit includes:
0.12mm BGA Reballing Stencil
- Precision laser-cut openings.
- Designed for accurate solder ball placement.
- Helps achieve consistent BGA soldering results.
BGA Reballing Platform
- Provides stable chip and PCB positioning.
- Reduces movement during reballing operations.
- Improves repair accuracy.
Positioning Fixture
- Ensures correct alignment between stencil and motherboard components.
- Helps technicians perform precise chip-level repairs.
Ideal for:
- Middle layer motherboard repair.
- BGA chip reballing.
- Advanced microsoldering.
- IC restoration.
- Professional smartphone motherboard maintenance.
