Description
iPhone 17 Pro Max 1SIM (EU) CNC Board for Swap – Upper + Lower
The CNC Board for Swap is a precision-machined replacement PCB designed for advanced motherboard repair and component transplantation on the iPhone 17 Pro Max.
It provides a prepared board platform for transferring original electronic components from a damaged motherboard to a replacement CNC-machined board, particularly in severe motherboard damage and advanced reconstruction cases.
Key Features
1. Precision CNC Machining
CNC machining prepares designated PCB areas for component transplantation and advanced microsoldering procedures.
2. Upper and Lower Board Layers
The package includes:
- Upper Board.
- Lower Board.
3. EU Version – 1 Physical SIM
Designed for the European iPhone 17 Pro Max hardware configuration with one physical SIM card. Always verify the board version against the original device before starting the repair.
4. Designed for Component SWAP
Suitable for transferring original components such as:
- CPU.
- Baseband IC.
- NAND Flash.
Applications
- Severe iPhone 17 Pro Max motherboard damage repair.
- CPU and Baseband transplantation.
- Original component transfer.
- Motherboard reconstruction and PCB layer repair.
- Advanced data recovery procedures requiring motherboard reconstruction.
Important Technical Note
This is a CNC-prepared replacement PCB, not a complete working motherboard. Original components must be transferred from the donor board according to the specific repair procedure.
Professional microsoldering skills and specialized equipment are required.
