iPhone 16 Plus CNC Board For Swap
290.00 LYD
Original iPhone 16 Plus donor logic board, precision-milled via CNC to safely remove underfilled ICs. The ultimate time-saving solution to preserve solder pads and minimize thermal stress during advanced board swap and data recovery procedures for the larger Plus model.
In stock
This product is a fully functional, original donor logic board specific to the internal architecture of the iPhone 16 Plus. It has been factory-prepped using cold CNC milling technology, making it instantly ready to receive transplanted components.
Technical Specifications & Features:
Exact Compatibility: Exclusively designed for the logic board layout of the iPhone 16 Plus.
Core Function: The premier professional solution for board swapping procedures (transferring CPU, Baseband, EEPROM) to restore power to dead devices or perform critical data recovery.
CNC Precision: Mechanical milling ensures all underlying solder pads remain 100% intact, flat, and ready for direct soldering without the need for harsh scraping or cleaning.
Maximum Thermal Protection: Eliminates the need for prolonged, high-heat desoldering of original underfilled ICs, effectively protecting the replacement board from thermal stress and PCB layer delamination.
Time & Labor Efficiency: Bypasses the tedious manual grinding process, significantly speeding up the repair turnaround time and boosting the overall swap success rate.
(Disclaimer): This product is strictly for Level 4 technicians requiring advanced micro-soldering skills. “Almhtrf” store is not responsible for damage caused by improper installation, transplanted component failure, or excessive heat.
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