AMAOE U-QSU6 Stencil
19.00 LYD
Professional stencil for reballing latest Snapdragon CPUs like SM8750, SM8650, and SM7635. 0.12mm UBGA expert series with anti-bulging heat dissipation design by AMAOE.
In stock
The U-QSU6 reballing stencil from AMAOE is part of the UBGA expert series, designed for advanced repair professionals working on the latest Qualcomm Snapdragon CPUs:
Snapdragon 8 Gen3 – SM8750 / SM8650
Snapdragon 8s Gen3 – SM8635
Snapdragon 7s Gen3 – SM7635
Snapdragon 7 Gen3 – SM7550
Snapdragon 4 Gen2 – SM4450
SM7435 / SM6450 / and more…
Engineered with 0.12mm thickness for precision and durability, the stencil features anti-bulging heat dissipation holes, helping technicians achieve flawless and efficient reballing under heat.
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