AMAOE HW3 Stencil for Huawei
16.00 LYD
Tool for reballing ICs on Huawei devices
In stock
AMAOE HW3 Stencil suitable for reballing BGA ICs on Huawei devices. – Made from heat-resistant steel. – Designed for chips like Kirin 950 and Kirin 955. – Suitable for devices like P9, Mate8, Honor8, and Magic. – Provides precise openings for even distribution of solder paste.
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MAECENAS IACULIS
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