SKU: 029
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AMAOE Stencil Huawei HW6 16.00 LYD
AMAOE EMMC2 BGA Reballing Stencil for EMMC/EMCP/UFS Chips
19.00 LYD
High-precision stainless steel reballing stencil designed for EMMC, EMCP, and UFS IC reballing in professional micro-soldering environments.
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Description
The AMAOE EMMC2 reballing stencil is engineered for technicians who work on advanced memory ICs such as EMMC, EMCP, and UFS packages. Manufactured from durable, heat-resistant stainless steel, it provides accurate ball placement and uniform heat distribution during the reballing process. The stencil includes multiple layouts compatible with common BGA footprints used in mobile phones, ensuring stable positioning and clean ball alignment. Ideal for NAND repair, data recovery work, and motherboard-level IC replacement.
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Amaoe
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