AMAOE EMMC Universal Reballing Stencil for EMMC/EMCP/UFS ICs
16.00 LYD
High-precision stainless-steel reballing stencil designed for reballing EMMC, EMCP, and UFS IC packages used in modern smartphone motherboards.
In stock
The AMAOE EMMC reballing stencil is engineered for technicians performing IC-level board repairs. Manufactured from durable, heat-resistant stainless steel, it provides accurate hole alignment for EMMC, EMCP, and UFS packages including common BGA footprints. The stencil ensures uniform solder ball deposition and stable thermal performance during hot-air reflow. Ideal for chip replacement, data recovery, and advanced BGA repair workflows.
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