AMAOE Solder Paste 183
37.00 LYD
Low-melting-point solder paste with a 183 °C alloy, designed for precision BGA reballing and SMD soldering in mobile phone PCB repair.
In stock
The AMAOE 183 Solder Paste is formulated with a low-temperature alloy (melting point 183 °C) to reduce thermal stress on sensitive ICs and multilayer PCBs. It provides stable viscosity, uniform tin distribution, and strong wetting performance, ensuring clean and reliable solder joints.
Widely used in BGA reballing, IC rework, and fine-pitch SMD soldering, this paste minimizes oxidation and residue, making it suitable for professional micro-soldering operations in mobile phone and electronics repair labs. Compatible with hot air stations and infrared rework systems.
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