SKU: 756

Amaoe Reverse Middle Layer BGA Reballing Stencil Platform Set for Samsung S25 Ultra (S9380)

95.00 LYD

The professional Amaoe Middle Layer Reballing Platform designed specifically for the Samsung Galaxy S25 Ultra (S9380 M_RF). Features an advanced “reverse” design ensuring high-precision logic board positioning to strictly prevent stencil slipping during operation. Includes a strong magnetic base and a premium high-temperature resistant Japanese steel stencil, providing a highly stable and safe working environment to perfectly reball and solder the double-layered boards on the very first try.

In stock

SKU: 756 Category: Brand:

Description

Repairing complex, flagship devices like the Samsung S25 Ultra strictly requires flawless tools. The Amaoe Middle Layer Reballing Set completely eliminates the technician’s struggle with shifting stencils or misaligned solder pads. The innovative reverse platform perfectly cradles the logic board, allowing you to seamlessly spread solder paste and apply heat with total confidence. Engineered with general safety standards in mind, this set strictly protects delicate components from excessive thermal damage and provides excellent insulation during heavy-duty operation.

Technical Specifications & Features:

  • Exclusive 1:1 Compatibility: Precision-engineered to perfectly and flawlessly match the intricate middle layer (M_RF) of the Samsung Galaxy S25 Ultra (S9380).

  • Reverse Platform Design: An advanced positioning base that completely prevents the stencil from slipping during solder paste application, guaranteeing perfectly uniform solder balls.

  • Premium Stencil Material: Forged from high-quality Japanese steel that absolutely refuses to warp or deform under the extreme heat of hot air stations.

  • Strong Magnetic Base: A firm magnetic hold provides maximum stability, strictly maintaining the safety of the logic board and preventing any vibration during the entire reballing process.

  • Laser-Cut Precision: Ensures perfectly smooth solder flow and strictly prevents solder ball bridging, delivering flawlessly clean and professional results on the first attempt.

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