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  • All categories
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Amaoe Reverse Middle Layer BGA Reballing Stencil Platform Set for Samsung S25 Ultra (S938U/W/D/B/BE/B2)

Home » Product » Amaoe Reverse Middle Layer BGA Reballing Stencil Platform Set for Samsung S25 Ultra (S938U/W/D/B/BE/B2)
SKU: 757

Amaoe Reverse Middle Layer BGA Reballing Stencil Platform Set for Samsung S25 Ultra (S938U/W/D/B/BE/B2)

95.00 LYD

The professional Amaoe Middle Layer Reballing Platform tailored for the Samsung Galaxy S25 Ultra (specifically versions S938U/W/D/B/BE/B2). Utilizes an innovative “reverse” design to perfectly cradle and secure the logic board, strictly preventing stencil slipping during solder paste application. Equipped with a robust magnetic base and a deformation-resistant Japanese steel stencil, guaranteeing the highest precision and a flawless double-layer BGA reballing process on the very first attempt.

In stock

SKU: 757 Category: Brand:

Description

Working with the double-layered logic boards of the Samsung S25 Ultra strictly requires absolute stability and tools that match the precise engineering layout of each regional variant. This Amaoe set is strictly dedicated to matching the pads of the Global and US versions, providing the technician with a flawless, error-free tool. The reverse platform design completely eliminates issues with stencil warping or shifting during hot air application, and safely insulates surrounding components. This allows you to flawlessly re-merge the two layers with high professionalism and the highest standards of mechanical safety.

Technical Specifications & Features:

  • Broad & Exact Compatibility: Specifically engineered to perfectly match the middle layer layout of multiple S25 Ultra variants (S938U/W/D/B/BE/B2).

  • Reverse Platform Design: Ensures the logic board and stencil remain a single, completely stable block, strictly preventing solder paste from seeping underneath and forming uneven balls.

  • Heat-Resistant Japanese Steel: A premium quality stencil built to withstand continuous high temperatures without warping or deforming (Anti-warping).

  • Strong Magnetic Base: Delivers a firm magnetic hold that firmly secures the set to your workbench, preventing any vibrations during the reballing process.

  • Precision Laser-Cut Holes: Guarantees perfectly smooth solder paste flow, forming precise BGA balls that strictly prevent trace bridging and shorts.

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