2UUL Red Skull Solder Paste (148℃ 183℃ 199℃) 50g
35.00 LYD
Professional-grade BGA solder paste available in 148°C, 183°C, and 199°C melting points, designed for IC reballing, SMD repair, and precision micro-soldering.
| Model | 148 ,183 ,199 |
|---|
The 2UUL Red Skull Series Solder Paste is formulated for high-precision BGA and SMD repair work. Each variant provides a different melting point—148°C low-temperature alloy, 183°C Sn63/Pb37 alloy, and 199°C high-temperature formulation—allowing technicians to choose the optimal paste depending on the PCB heat tolerance and IC type.
This solder paste delivers consistent ball formation, stable viscosity, and clean wetting performance, making it ideal for reballing IC chips, jump-wire bonding, pad repair, and general micro-soldering tasks.
It is packaged in airtight containers to maintain freshness, reduce oxidation, and ensure reliable flow during stencil application or manual dispensing.
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