2UUL FS158 JOINT X Solder Paste for Repair 158℃ / 183℃ / 200℃ 50g
43.00 LYD
Premium JOINT X Series solder paste (Tin Cream) by 2UUL.
Available in 3 melting point options (158℃, 183℃, 200℃) to suit specific soldering needs.
Features fine particles, excellent wettability, and strong joint formation.
Net Weight: 50g.
| Temperature Grades | 158℃ ,183℃ ,200℃ |
|---|
Product Overview: The 2UUL JOINT X Solder Paste is a high-performance tin paste designed for professional mobile repair and micro-soldering. It offers a smooth texture and consistent quality, ensuring perfect BGA reballing and component soldering.
Select Your Variation: This product is available in three temperature grades. Please select the one that matches your repair requirement:
158℃ (Low Temp): Ideal for heat-sensitive components, Face ID repair, and iPhone “Sandwich” middle layers to prevent overheating delicate parts.
183℃ (Medium/Standard Temp): The industry standard for general soldering, logic board repairs, and most BGA reballing tasks. Offers the best balance of strength and heat.
200℃ (High Temp): Designed for high-strength soldering or specific applications where the joint needs to withstand higher operating temperatures without reflowing.
Key Features:
Smooth Consistency: Fine solder particles ensure even distribution and easy application through stencils.
Strong Joints: Creates bright, shiny, and reliable solder joints with excellent conductivity.
Good Wettability: Flows easily onto pads and minimizes bridging or cold solder joints.
Fresh Formula: Packaged in a 50g jar to ensure longevity and freshness.
Specifications:
Brand: 2UUL
Series: JOINT X
Weight: 50g
Microns: T4 / T5 (Fine Pitch)
Available Melting Points: 158℃, 183℃, 200℃
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