2UUL DA28 FlatCut Solder Pad Underfill Glue Fast Removal Blades (5pcs/box)
21.00 LYD
Professional flat-edge blades designed for efficient underfill removal and solder pad leveling. Ensures a perfectly flat PCB surface, preparing the pads for new IC installation with speed and safety.
In stock
The 2UUL DA28 FlatCut Blades are engineered for the critical cleaning phase of motherboard repair. Their flat, straight-edge design makes them the superior choice for leveling solder pads and removing stubborn underfill adhesive efficiently.
Features & Specifications:
Flat Edge Geometry: The straight blade design distributes pressure needs evenly across the PCB surface, significantly minimizing the risk of gouging the solder mask or lifting pads compared to pointed blades.
High Efficiency: Optimized for cleaning large surface areas such as CPU and NAND pads, allowing technicians to remove adhesive residue and excess solder quickly.
Durability & Rigidity: Crafted from hardened alloy steel that maintains a perfectly straight edge under thermal stress, preventing blade flex that can damage components.
Pack Quantity: Supplied in a box of 5 replacement blades to support high-volume repair workflows.
Application: Ideal for preparing the motherboard surface (“wicking & scraping”) before installing new BGA components.
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