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  • All categories
  • KBS Screens
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YCS NAND / eMMC / UFS Memory Green Oil & BGA Reballing Stencil (BGA 60 to 315)

Home » Product » YCS NAND / eMMC / UFS Memory Green Oil & BGA Reballing Stencil (BGA 60 to 315)
SKU: 2286

YCS NAND / eMMC / UFS Memory Green Oil & BGA Reballing Stencil (BGA 60 to 315)

17.00 LYD

Professional dual-function YCS stencil dedicated to BGA reballing and precise green oil (UV mask) application for smartphone memory chips (NAND/eMMC/UFS). Supports a massive range of BGA sizes from 60 to 315 for both iPhone and Android. The ultimate solution for professionally repairing and insulating damaged hard drive pads.

In stock

SKU: 2286 Category: Brand:

Description

This product is an indispensable tool for micro-soldering technicians specializing in storage upgrades, dead boot repairs, and critical data recovery. It masterfully combines precision reballing and reliable trace insulation into a single stencil.

Technical Specifications & Features:

  • Comprehensive BGA Support: Covers a massive range encompassing virtually all smartphone and tablet memory chip sizes: (BGA 60, 70, 110, 153, 162, 169, 178, 200, 221, 254, 297, 315). This includes iPhone NANDs (e.g., BGA110) and Android eMMC/UFS chips (e.g., BGA254, BGA153).

  • Dual-Function Design: Effortlessly reball memory ICs while utilizing dedicated precision cutouts to flawlessly apply UV green oil over rebuilt or damaged motherboard pads, ensuring perfect insulation before chip installation.

  • High-Precision CNC Machining: Crafted from premium steel that resists heat-induced warping and bulging (anti-drumming), guaranteeing perfectly uniform solder balls and actively preventing frustrating solder bridging.

  • Logic Board Rescue: The ultimate stencil for rebuilding torn memory pads securely and rapidly, significantly increasing the success rate of complex board swaps and resolving hardware-level software errors.

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